{
  "scope": "Selective primary-source CMP slurry manufacturer registry; inclusion is not qualification.",
  "lastVerified": "2026-10-04",
  "records": [
    {
      "id": "agc",
      "name": "AGC",
      "materials": [
        "oxide",
        "sti"
      ],
      "apps": "Oxide; shallow trench isolation; interlayer dielectric",
      "families": "CES-300 / 330F series ceria slurries",
      "docs": "Public application page; product-specific data and handling documents should be requested.",
      "geo": "The application page lists sales coverage in Japan, Taiwan, China, ASEAN, Europe and America. This does not establish manufacturing redundancy.",
      "source": "agc",
      "technology": "Ceria disclosed for CES series.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.agc.com/en/products/electoric/detail/cmp.html"
    },
    {
      "id": "anji",
      "name": "Anji Microelectronics",
      "materials": [
        "copper",
        "barrier",
        "tungsten",
        "oxide",
        "sti",
        "silicon"
      ],
      "apps": "Copper and barrier; tungsten; silica- and ceria-based dielectrics; silicon substrates; emerging packaging applications",
      "families": "Application categories disclosed; exact candidate grades must be requested.",
      "docs": "Public solutions overview; obtain grade-specific TDS, SDS, release specifications and qualification data.",
      "geo": "Company describes a China-based business serving international markets. Candidate manufacturing and backup sites need confirmation.",
      "source": "anji",
      "technology": "Silica- and ceria-based dielectric systems disclosed.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.anjimicro.com/en/jiejuefangan.html"
    },
    {
      "id": "entegris",
      "name": "Entegris",
      "materials": [
        "copper",
        "barrier",
        "tungsten",
        "oxide",
        "aluminum"
      ],
      "apps": "Copper; barrier; tungsten; dielectrics; aluminum / gate-stack polishing",
      "families": "EPOCH (copper); i-Cue and Sentinel (barrier); WIN and Semi-Sperse (tungsten); iDIEL (dielectrics); Novus (aluminum).",
      "docs": "Public slurry catalog and current portfolio brochure; request product-specific TDS, SDS and process data.",
      "geo": "Verify the manufacturing and application-support sites for the candidate grade directly; global catalog availability is not a supply guarantee.",
      "source": "entegris",
      "extra": "entfamilies",
      "technology": "Fumed silica disclosed for Semi-Sperse in the linked portfolio brochure; do not generalize across families.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.entegris.com/shop/en/USD/Products/Chemistries/Specialty-Chemicals/Slurries/c/CMPSlurries"
    },
    {
      "id": "fujifilm",
      "name": "FUJIFILM Electronic Materials",
      "materials": [
        "copper",
        "barrier",
        "cobalt",
        "oxide"
      ],
      "apps": "Copper overfill; barrier; cobalt interconnects; front-end applications",
      "families": "Application-level slurry offerings on the cited page; product identifiers are not specified there.",
      "docs": "Public CMP application descriptions; request exact product documentation. Post-CMP cleaners are a separate product class.",
      "geo": "United States regional site reviewed; local supply, support and qualification availability must be confirmed.",
      "source": "fujifilm",
      "technology": "Abrasive identity not specified in the reviewed application page; request grade-level data.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.fujifilm.com/us/en/business/semiconductor-materials/cmp"
    },
    {
      "id": "fujimi",
      "name": "FUJIMI",
      "materials": [
        "copper",
        "barrier",
        "tungsten",
        "oxide",
        "polysilicon"
      ],
      "apps": "Oxide; tungsten; polysilicon; copper; copper/tantalum and other barrier films",
      "families": "PLANERLITE 4000 (oxide), 5000 (W), 6000 (poly-Si), 7000 (Cu), 8000 (barrier).",
      "docs": "Public product-family lineup; ask for the actual grade, current TDS / SDS and supporting data.",
      "geo": "English product lineup from the Japan corporate site reviewed. Confirm candidate-specific production and regional support.",
      "source": "fujimi",
      "technology": "Exact abrasive system not specified in the reviewed lineup; request grade-level data.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.fujimiinc.co.jp/english/service/cmp/lineup.html"
    },
    {
      "id": "merck",
      "name": "Merck / EMD Electronics",
      "materials": [
        "copper",
        "barrier",
        "tungsten",
        "oxide",
        "sti",
        "silicon"
      ],
      "apps": "Dielectrics / STI; copper bulk and barrier; tungsten bulk and buff; silicon polishing; advanced packaging",
      "families": "Application platforms; Mazin and Syton are named for silicon polishing on the primary page.",
      "docs": "Public planarization overview; grade selection and product-specific documentation require an application inquiry.",
      "geo": "EMD Electronics primary page reviewed; confirm the selling entity and production/support sites for the buying region.",
      "source": "merck",
      "technology": "Integrated abrasive and additive platforms disclosed; grade-level technology must be confirmed.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.emdgroup.com/en/expertise/electronics/technologies/planarization.html"
    },
    {
      "id": "qnity",
      "name": "Qnity",
      "materials": [
        "barrier",
        "tungsten",
        "oxide",
        "polysilicon",
        "silicon",
        "tsv"
      ],
      "apps": "Tungsten; dielectric / nitride / polysilicon; barrier; TSV; advanced packaging",
      "families": "Novaplane (W), Optiplane (dielectric), Acuplane (barrier/TSV), Klebosol (colloidal silica), Stackplane (advanced packaging).",
      "docs": "Current primary slurry page with product-family links and technical / safety-document routes.",
      "geo": "Current Qnity product site reviewed; confirm grade availability and local selling/support entities directly.",
      "source": "qnity",
      "technology": "Colloidal silica disclosed for Klebosol; do not generalize across other families.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://www.qnityelectronics.com/cmp-slurries.html"
    },
    {
      "id": "resonac",
      "name": "Resonac",
      "materials": [
        "oxide"
      ],
      "apps": "High step-height oxide planarization, including memory-manufacturing context described by the supplier",
      "families": "HS-0 series ceria slurry on the cited regional product page.",
      "docs": "Public series-level technical description; request current candidate-grade TDS, SDS and patterned evidence.",
      "geo": "Europe regional product page reviewed. Sales-page geography does not verify manufacturing location.",
      "source": "resonac",
      "technology": "Ceria disclosed for HS-0 series.",
      "lastVerified": "2026-10-04",
      "sourceURL": "https://eu.resonac.com/project/high-removal-rate-ceria-slurry/"
    }
  ]
}