Verified manufacturer directory
8 manufacturers · alphabetical order
AGC
PRIMARY RECORD / AGC- CMP applications
- Oxide; shallow trench isolation; interlayer dielectric
- Product families
- CES-300 / 330F series ceria slurries
- Disclosed technology
- Ceria disclosed for CES series.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public application page; product-specific data and handling documents should be requested.
- Geographic evidence
- The application page lists sales coverage in Japan, Taiwan, China, ASEAN, Europe and America. This does not establish manufacturing redundancy.
- Primary source
- AGC — CMP Slurry ↗
Anji Microelectronics
PRIMARY RECORD / ANJI- CMP applications
- Copper and barrier; tungsten; silica- and ceria-based dielectrics; silicon substrates; emerging packaging applications
- Product families
- Application categories disclosed; exact candidate grades must be requested.
- Disclosed technology
- Silica- and ceria-based dielectric systems disclosed.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public solutions overview; obtain grade-specific TDS, SDS, release specifications and qualification data.
- Geographic evidence
- Company describes a China-based business serving international markets. Candidate manufacturing and backup sites need confirmation.
- Primary source
- Anji Microelectronics — Solutions ↗
Entegris
PRIMARY RECORD / ENTEGRIS- CMP applications
- Copper; barrier; tungsten; dielectrics; aluminum / gate-stack polishing
- Product families
- EPOCH (copper); i-Cue and Sentinel (barrier); WIN and Semi-Sperse (tungsten); iDIEL (dielectrics); Novus (aluminum).
- Disclosed technology
- Fumed silica disclosed for Semi-Sperse in the linked portfolio brochure; do not generalize across families.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public slurry catalog and current portfolio brochure; request product-specific TDS, SDS and process data.
- Geographic evidence
- Verify the manufacturing and application-support sites for the candidate grade directly; global catalog availability is not a supply guarantee.
- Primary source
- Entegris — Slurries portfolio ↗ · Product-family brochure ↗
FUJIFILM Electronic Materials
PRIMARY RECORD / FUJIFILM- CMP applications
- Copper overfill; barrier; cobalt interconnects; front-end applications
- Product families
- Application-level slurry offerings on the cited page; product identifiers are not specified there.
- Disclosed technology
- Abrasive identity not specified in the reviewed application page; request grade-level data.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public CMP application descriptions; request exact product documentation. Post-CMP cleaners are a separate product class.
- Geographic evidence
- United States regional site reviewed; local supply, support and qualification availability must be confirmed.
- Primary source
- FUJIFILM Electronic Materials — CMP Slurries ↗
FUJIMI
PRIMARY RECORD / FUJIMI- CMP applications
- Oxide; tungsten; polysilicon; copper; copper/tantalum and other barrier films
- Product families
- PLANERLITE 4000 (oxide), 5000 (W), 6000 (poly-Si), 7000 (Cu), 8000 (barrier).
- Disclosed technology
- Exact abrasive system not specified in the reviewed lineup; request grade-level data.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public product-family lineup; ask for the actual grade, current TDS / SDS and supporting data.
- Geographic evidence
- English product lineup from the Japan corporate site reviewed. Confirm candidate-specific production and regional support.
- Primary source
- FUJIMI — CMP product line-up ↗
Merck / EMD Electronics
PRIMARY RECORD / MERCK- CMP applications
- Dielectrics / STI; copper bulk and barrier; tungsten bulk and buff; silicon polishing; advanced packaging
- Product families
- Application platforms; Mazin and Syton are named for silicon polishing on the primary page.
- Disclosed technology
- Integrated abrasive and additive platforms disclosed; grade-level technology must be confirmed.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public planarization overview; grade selection and product-specific documentation require an application inquiry.
- Geographic evidence
- EMD Electronics primary page reviewed; confirm the selling entity and production/support sites for the buying region.
- Primary source
- Merck / EMD Electronics — Planarization ↗
Qnity
PRIMARY RECORD / QNITY- CMP applications
- Tungsten; dielectric / nitride / polysilicon; barrier; TSV; advanced packaging
- Product families
- Novaplane (W), Optiplane (dielectric), Acuplane (barrier/TSV), Klebosol (colloidal silica), Stackplane (advanced packaging).
- Disclosed technology
- Colloidal silica disclosed for Klebosol; do not generalize across other families.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Current primary slurry page with product-family links and technical / safety-document routes.
- Geographic evidence
- Current Qnity product site reviewed; confirm grade availability and local selling/support entities directly.
- Primary source
- Qnity — CMP Slurries ↗
Resonac
PRIMARY RECORD / RESONAC- CMP applications
- High step-height oxide planarization, including memory-manufacturing context described by the supplier
- Product families
- HS-0 series ceria slurry on the cited regional product page.
- Disclosed technology
- Ceria disclosed for HS-0 series.
- Last verified
- · Reusable source records (JSON) ↓
- Documentation
- Public series-level technical description; request current candidate-grade TDS, SDS and patterned evidence.
- Geographic evidence
- Europe regional product page reviewed. Sales-page geography does not verify manufacturing location.
- Primary source
- Resonac Europe — High Removal Rate Ceria Slurry ↗
Inclusion is based on primary product evidence
This initial directory includes eight manufacturers whose own product or application pages disclose CMP slurry offerings relevant to semiconductor processing. Entries are alphabetical. Inclusion is not an endorsement, a product recommendation or evidence of qualification at any fab.
Sources were reviewed on October 4, 2026. Application scope is limited to what the linked sources disclose. The directory is not exhaustive; market reports and reseller SEO lists were not used as proof of participation.
How to turn a directory match into a shortlist
- Define target film, adjacent films and polish stage before contacting suppliers.
- Request an exact grade, TDS, applicable SDS, preparation instructions and representative COA.
- Ask which supporting data were measured on comparable films and patterned wafers.
- Confirm local support, qualification quantities, lead time and remaining shelf life at receipt.
- Assess release controls, lot consistency, changes and continuity before approving production supply.
For a supplier that does not disclose a required detail publicly, record “not verified” and request evidence. Do not fill the gap with an assumption about capacity, purity, manufacturing site or market presence.
Independent discovery, with limits
No supplier ranking, market share, pricing, customer relationship or fab-qualification claim is published here. No paid placement or supplier-introduction service is active. Commercial relationships will not determine inclusion in independent comparisons or technical conclusions.
Coverage can expand when a manufacturer’s own current source supports a distinct offering. A future profile should attach evidence and a verification date to each field rather than adding unverified commercial claims. See the editorial methodology for the source and inclusion rules.
Sources & evidence
- AGC — CMP Slurry ↗Manufacturer primary source. CES-300 / 330F series ceria slurries for STI and ILD; listed sales regions are not proof of redundant manufacturing.
- Anji Microelectronics — Solutions ↗Manufacturer primary source. Copper/barrier, tungsten, dielectric, ceria and silicon substrate slurry categories.
- Entegris — Slurries portfolio ↗Manufacturer primary source. Disclosed copper, barrier, tungsten, dielectric and aluminum CMP categories.
- Entegris — Synergies to Improve CMP Yield brochure ↗Manufacturer brochure · 2026. Disclosed EPOCH, i-Cue, Sentinel, WIN, Semi-Sperse, iDIEL and Novus slurry families.
- FUJIFILM Electronic Materials — CMP Slurries ↗Manufacturer primary source. Copper, barrier, cobalt and front-end slurry categories; post-CMP cleaners are separately identified.
- FUJIMI — CMP product line-up ↗Manufacturer primary source. PLANERLITE oxide, tungsten, polysilicon, copper and barrier product families.
- Merck / EMD Electronics — Planarization ↗Manufacturer primary source. Dielectric, copper bulk/barrier, tungsten, silicon polishing and integrated cleaning portfolio.
- Qnity — CMP Slurries ↗Manufacturer primary source. Stackplane, Novaplane, Optiplane, Acuplane and Klebosol applications; Klebosol trademark attribution is disclosed on the source.
- Resonac Europe — High Removal Rate Ceria Slurry ↗Manufacturer primary source. HS-0 series ceria slurry for high step-height oxide patterns.